Kandou Bus
Ultra-high speed chip-to-chip connection technology, with low energy consumption, for electronic systems.
Contact
EPFL Innovation Park, Bâtiment i1015 Lausanne (VD)
Phone: -
Fax:
sales@kandou.com
http://https://www.kandou.com
Ultra-high speed chip-to-chip connection technology, with low energy consumption, for electronic systems.
Studer et Smartsuna partagent leur retour d'expérience après la...
Date: 28th-30th March 2023 Location: Lausanne - SwissTech...