Kandou Bus
Ultra-high speed chip-to-chip connection technology, with low energy consumption, for electronic systems.
Contact
EPFL Innovation Park, Bâtiment i1015 Lausanne (VD)
Phone: -
Fax:
sales@kandou.com
http://https://www.kandou.com
Ultra-high speed chip-to-chip connection technology, with low energy consumption, for electronic systems.
Pour répondre à une demande croissante et accélérer la...